Bendable electronic parts heat up by themselves like 'heat pack' and lower the manufacturing temperature barrier

A research team has developed liquid-processed thin-film transistors that can maintain high performance at low temperatures — They are expected to be used in the next generation of high-performance flexible electronics and wearable devices as they can operate on plastic substrates and maintain stable performance under repeated mechanical bending.
Read more: Bendable electronic parts heat up by themselves like 'heat pack' and lower the manufacturing temperature barrier